Chip packaging and testing
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Announced / planned — delivery not confirmed
Applied Materials and Micron Technology announced a collaboration plan.
Product / business: Chip packaging and testing
Source description and scope
Applied Materials and Micron announced EPIC Center collaboration on DRAM, HBM, NAND and advanced packaging
Dated company disclosure; no exclusive supply, contract value or current shipment volume inferred.
- Applied Materials and Micron announced EPIC Center collaboration on DRAM, HBM, NAND and advanced packaging ↗
Source published: 2026-03-10