Chip packaging and testing
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Announced / planned — delivery not confirmed
Amkor Technology and TSMC announced a collaboration plan.
Product / business: Chip packaging and testing
Source description and scope
Amkor and TSMC signed an MOU for advanced packaging and test collaboration in Arizona
Planned Arizona capacity and services; do not infer that the facility is operational.
- Amkor and TSMC signed an MOU for advanced packaging and test collaboration in Arizona ↗
Source published: 2024-10-04