Skip to content
Search companies →

半导体材料

ChinaKonfoong Materials

300666 · Shenzhen

Latest earnings

2026-09-30
关于2026年半年度报告的更正公告 ↗

Latest company announcements

Estimated market cap

¥61.48B CNY

≈ $9.17B USD · USD/CNY 6.7045 on 2026-09-30

As of 2026-09-30

Calculation details

A-share close × total issued shares (all share classes, including H shares).

Close: ¥222.78 · Total shares: 275,971,083 (A 275,971,083)

Share structure effective 2026-06-30 · confirmed 2026-10-02

Share structure source ↗

Annual financials

2025 · Consolidated annual statements · CNY

Annual revenue
4.6B CNY
Annual net income attributable to parent
499.5M CNY

Published 2026-04-16 · Eastmoney via AKShare ↗

Loading company research…

Company articles

Publish an idea

Loading…

Company overview

半导体晶圆制造及封装用高纯溅射靶材。

Sources

国证行业分类 2026-6 ↗
Website
Visit ↗
Filings
Visit ↗

Financial report at last profile review

2026年半年度报告 ↗

Period ended 2026-06-30 · Published 2026-08-25

Sources checked 2026-09-13

Loading your outlook…