晶圆制造
Hua Hong Semiconductor
688347 · Shanghai
Latest earnings · FY2026 Q1
2026-05-15Period ended 2026-03-31 · quarter
- Revenue · PRC GAAP
- 4.63B CNY
- Revenue YoY · PRC GAAP
- 18.22 %
Latest company announcements
- 2026-09-30 · Exchange filing2026年第三次临时股东会会议材料 ↗
- 2026-09-30 · Exchange filing港股公告：有关成立合营企业的补充公告 ↗
- 2026-09-30 · Exchange filing关于召开2026年第三次临时股东会的通知 ↗
Estimated market cap
¥400.97B CNY
≈ $59.81B USD · USD/CNY 6.7045 on 2026-09-30
As of 2026-09-30
Calculation details
A-share close × total issued shares (all share classes, including H shares).
Close: ¥207.92 · Total shares: 1,928,494,794 (A 598,518,392 + H 1,329,976,402)
Share structure effective 2026-09-09 · confirmed 2026-10-02
Share structure source ↗Annual financials
2025 · Consolidated annual statements · CNY
- Annual revenue
- 17.29B CNY
- Annual net income attributable to parent
- 376.61M CNY
Published 2026-03-27 · Eastmoney via AKShare ↗
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Company articles
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Company overview
特色工艺晶圆代工，属于通用使能环节。
Sources
国证行业分类 2026-6 ↗- Office address
- 中国上海市浦东新区哈雷路288号 ↗
- Website
- Visit ↗
- Filings
- Visit ↗
Financial report at last profile review
2026年半年度报告 ↗Period ended 2026-06-30 · Published 2026-08-27
Sources checked 2026-09-13
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