公司研究
高通 (QCOM)正在加载 SEC 业务与财务数据…
设计或提供 AI 计算所需的处理器与加速器。
资料可能描述历史情况或未来计划，资料发布日期不代表当前已交付。 ✓ 已核实：两家公司之一在其监管文件、投资者关系公告或官方声明中确认了该关系，且来源链接已在复核日期检查。
相关产品或业务详见来源说明
已宣布／计划中，尚不代表已交付
格芯已宣布计划向高通提供产品或服务。
产品／业务: 相关产品或业务详见来源说明
GlobalFoundries and Qualcomm extended their semiconductor manufacturing capacity agreement through 2028
Contracted capacity; not a claim of GPU production or completed future purchases.
Snapdragon X2
已有来源记录，以资料所述状态为准
高通向微软提供产品或服务。
产品／业务: Snapdragon X2
Qualcomm documents Snapdragon X2 series processors in Microsoft Surface Copilot+ PCs for on-device AI.
Source-specific relationship; no exclusivity, purchase volume, or future completion inferred.
设计工具／技术认证
已有来源记录，以资料所述状态为准
高通与江波龙存在有来源记录的生态适配或合作。
产品／业务: 设计工具／技术认证
Longsys FORESEE automotive UFS passed compatibility certification for Qualcomm's 8155 cockpit platform.
Compatibility certification only; 8295 validation was still in progress at the source date.
设计工具／技术认证
已有来源记录，以资料所述状态为准
高通与佰维存储存在有来源记录的生态适配或合作。
产品／业务: 设计工具／技术认证
Biwin reported Qualcomm SoC platform certification for its embedded-storage products at MWC Shanghai 2025.
Platform qualification does not identify Qualcomm as a direct purchaser.
上市资料同步于 2026-04-16.
报告期末 2026-06-28 · 披露日期 2026-07-29
来源核查于 2026-09-13
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加载中…
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年度报告，截至 2025-09-28。这些是已披露的年度数据，不是过去十二个月的估算值。
We are a global technology leader, helping to bring intelligent computing everywhere through the development and commercialization of foundational technologies, including on-device artificial intelligence (AI), high-performance and low-power computing and advanced wireless connectivity. Our platforms help power intelligent devices that people and businesses rely on every day across industries and applications from handsets to other areas, including automotive and the internet of things (IoT).
摘自第 1 项“业务”；披露于 2025-11-05。内容可能经过截取。
来源：SEC Company Facts。核查于 2026-10-04。数据在后台更新。缺失或含义不明确的数据不予展示。
