晶圆制造
Hua Hong Semiconductor
688347 · Shanghai
- Office address
- 中国上海市浦东新区哈雷路288号 ↗
- Website
- Visit ↗
- Filings
- Visit ↗
Financial report at last profile review
2026年半年度报告 ↗Period ended 2026-06-30 · Published 2026-08-27
Source review history
Sources checked 2026-09-13 · Profile review date, separate from quote updates.
Latest earnings
2026-10-22Latest company announcements
- 2026-10-23 · Exchange filing上海市通力律师事务所关于华虹宏力半导体有限公司2026年第三次临时股东会的法律意见书 ↗
- 2026-10-23 · Exchange filing2026年第三次临时股东会决议公告 ↗
- 2026-10-22 · Exchange filing港股公告：有关建议修订二零二六年华虹集团相关持续关联交易年度上限的公告 ↗
688347
特色工艺晶圆代工，属于通用使能环节。
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◆ Earnings◇ Insider trades⬡ Relationships● Business■ Corporate actions＋ Financing✦ Governance○ Other
Events use source publication dates; missing prices are not filled.
Estimated market cap
¥319.17B CNY
≈ $47.82B USD · USD/CNY 6.6745 on 2026-10-22
As of 2026-10-23
Calculation details
A-share close × total issued shares (all share classes, including H shares).
Close: ¥165.50 · Total shares: 1,928,494,794 (A 598,518,392 + H 1,329,976,402)
Share structure effective 2026-09-09 · confirmed 2026-10-23
Share structure source ↗Annual financials
2025 · Consolidated annual statements · CNY
- Annual revenue
- 17.29B CNY
- Annual net income attributable to parent
- 376.61M CNY
Published 2026-03-27 · Eastmoney via AKShare ↗
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Company overview
特色工艺晶圆代工，属于通用使能环节。