半导体材料
Konfoong Materials
300666 · Shenzhen
Latest earnings
2026-09-30Latest company announcements
- 2026-10-13 · Exchange filing关于完成工商变更登记并换发营业执照的公告 ↗
- 2026-10-13 · Exchange filing关于全资子公司与专业投资机构共同投资设立有限合伙企业暨关联交易的进展公告 ↗
- 2026-10-09 · Exchange filing关于控股股东、实际控制人部分股份质押的公告 ↗
300666
半导体晶圆制造及封装用高纯溅射靶材。
Events, price & volume
1M
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◆ Earnings◇ Insider trades⬡ Relationships● Business■ Corporate actions＋ Financing✦ Governance○ Other
Events use source publication dates; missing prices are not filled.
Estimated market cap
¥55B CNY
≈ $8.22B USD · USD/CNY 6.6925 on 2026-10-12
As of 2026-10-13
Calculation details
A-share close × total issued shares (all share classes, including H shares).
Close: ¥199.31 · Total shares: 275,971,083 (A 275,971,083)
Share structure effective 2026-06-30 · confirmed 2026-10-09
Share structure source ↗Annual financials
2025 · Consolidated annual statements · CNY
- Annual revenue
- 4.6B CNY
- Annual net income attributable to parent
- 499.5M CNY
Published 2026-04-16 · Eastmoney via AKShare ↗
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Company overview
半导体晶圆制造及封装用高纯溅射靶材。
Sources
国证行业分类 2026-6 ↗- Office address
- 浙江省余姚市经济开发区名邦科技工业园区安山路 ↗
- Website
- Visit ↗
- Filings
- Visit ↗
Financial report at last profile review
2026年半年度报告 ↗Period ended 2026-06-30 · Published 2026-08-25
Source review history
Sources checked 2026-09-13 · Profile review date, separate from quote updates.