先进封装与测试
Tongfu Microelectronics
002156 · Shenzhen
Latest earnings · FY2026
2026-08-29Period ended 2026-06-30 · half year
- Revenue · PRC GAAP
- 16.04B CNY
- Revenue YoY · PRC GAAP
- 23.03%
Latest company announcements
- 2026-09-24 · Exchange filing国泰海通证券股份有限公司关于通富微电子股份有限公司使用闲置募集资金进行现金管理的核查意见 ↗
- 2026-09-24 · Exchange filing关于使用承兑汇票、信用证及自有外汇支付募集资金投资项目所需资金并以募集资金等额置换的公告 ↗
- 2026-09-24 · Exchange filing关于变更公司注册资本并修订《公司章程》的公告 ↗
002156
集成电路封装测试与高性能计算封装技术。
Events, price & volume
1M
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◆ Earnings◇ Insider trades⬡ Relationships● Business■ Corporate actions＋ Financing✦ Governance○ Other
Events use source publication dates; missing prices are not filled.
Estimated market cap
¥85.78B CNY
≈ $12.82B USD · USD/CNY 6.6925 on 2026-10-12
As of 2026-10-13
Calculation details
A-share close × total issued shares (all share classes, including H shares).
Close: ¥53.82 · Total shares: 1,593,797,706 (A 1,593,797,706)
Share structure effective 2026-09-16 · confirmed 2026-10-09
Share structure source ↗Annual financials
2025 · Consolidated annual statements · CNY
- Annual revenue
- 27.92B CNY
- Annual net income attributable to parent
- 1.22B CNY
Published 2026-04-17 · Eastmoney via AKShare ↗
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Company overview
集成电路封装测试与高性能计算封装技术。
Sources
国证行业分类 2026-6 ↗- Office address
- 江苏省南通市崇川路 288 号 ↗
- Website
- Visit ↗
- Investor relations
- Visit ↗
- Filings
- Visit ↗
Financial report at last profile review
2026年半年度报告 ↗Period ended 2026-06-30 · Published 2026-08-29
Source review history
Sources checked 2026-09-13 · Profile review date, separate from quote updates.