公司研究
应用材料 (AMAT)正在加载 SEC 业务与财务数据…
参与 AI 产业链的半导体制造环节。
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芯片封装与测试
已宣布／计划中，尚不代表已交付
应用材料与美光科技已宣布合作计划。
产品／业务: 芯片封装与测试
Applied Materials and Micron announced EPIC Center collaboration on DRAM, HBM, NAND and advanced packaging
Dated company disclosure; no exclusive supply, contract value or current shipment volume inferred.
上市资料同步于 2026-04-16.
报告期末 2026-07-26 · 披露日期 2026-08-20
来源核查于 2026-09-13
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年度报告，截至 2025-10-26。这些是已披露的年度数据，不是过去十二个月的估算值。
Applied Materials, Inc. is the leader in the materials engineering solutions used to produce virtually every semiconductor in the world. Semiconductors provide the foundation for advances in technology that are reshaping the global economy, including artificial intelligence, the internet of things, robotics, electric and autonomous vehicles, and clean energy. We are experts in the design, development, production, and servicing of the critical wafer fabrication tools our customers need to manufacture semiconductors.
摘自第 1 项“业务”；披露于 2025-12-12。内容可能经过截取。
来源：SEC Company Facts。核查于 2026-10-04。数据在后台更新。缺失或含义不明确的数据不予展示。
