公司研究
天弘科技 (CLS)正在加载 SEC 业务与财务数据…
参与 AI 产业链的系统与终端环节。
资料可能描述历史情况或未来计划，资料发布日期不代表当前已交付。 ✓ 已核实：两家公司之一在其监管文件、投资者关系公告或官方声明中确认了该关系，且来源链接已在复核日期检查。
Helios / 网络互连
已宣布／计划中，尚不代表已交付
超威半导体与天弘科技已宣布合作计划。
产品／业务: Helios / 网络互连
Celestica and AMD announced Helios collaboration covering design and manufacturing of scale-up networking switches, with customer availability planned for late 2026.
Announced development collaboration; not proof of completed late-2026 shipments.
上市资料同步于 2026-04-16.
报告期末 2026-06-30 · 披露日期 2026-07-27
来源核查于 2026-09-13
正在加载你的观点…
加载中…
正在加载公司动态…
年度报告，截至 2025-12-31。这些是已披露的年度数据，不是过去十二个月的估算值。
Celestica is a technology leader with deep expertise in design, engineering, manufacturing, supply chain, and platform solutions. Celestica enables critical data center infrastructure for AI, cloud and hybrid cloud, and advances technologies in high-growth markets. We serve across two operating and reportable segments: Connectivity and Cloud Solutions (CCS) and Advanced Technology Solutions (ATS). See note 21 to the 2025 consolidated annual financial statements (2025 AFS) included herein.
摘自第 1 项“业务”；披露于 2026-02-27。内容可能经过截取。
来源：SEC Company Facts。核查于 2026-10-04。数据在后台更新。缺失或含义不明确的数据不予展示。
