公司研究
超威半导体 (AMD)报告期截至 2026-06-27 · 季度
正在加载 SEC 业务与财务数据…
设计或提供 AI 计算所需的处理器与加速器。
资料可能描述历史情况或未来计划，资料发布日期不代表当前已交付。 ✓ 已核实：两家公司之一在其监管文件、投资者关系公告或官方声明中确认了该关系，且来源链接已在复核日期检查。
半导体制造
已有来源记录，以资料所述状态为准
格芯向超威半导体提供产品或服务。
产品／业务: 半导体制造
12/14nm HPC wafer manufacturing, not advanced-node GPU fabrication
Only supports the stated product and source date; no exclusivity, procurement value or completed future capacity inferred.
资料发布日期: 2026-02-04
HBM3E / Instinct MI350
已有来源记录，以资料所述状态为准
美光科技向超威半导体提供产品或服务。
产品／业务: HBM3E / Instinct MI350
HBM3E design integration in Instinct MI350
Only supports the stated product and source date; no exclusivity, procurement value or completed future capacity inferred.
资料发布日期: 未注明
半导体制造
已有来源记录，以资料所述状态为准
台积电向超威半导体提供产品或服务。
产品／业务: 半导体制造
Wafer manufacturing
Only supports the stated product and source date; no exclusivity, procurement value or completed future capacity inferred.
资料发布日期: 2026-02-04
芯片封装与测试
已有来源记录，以资料所述状态为准
通富微电向超威半导体提供产品或服务。
产品／业务: 芯片封装与测试
Tongfu disclosed its AMD packaging and testing relationship through its joint-venture and cooperation model
Subsidiary operations mapped to Tongfu parent; do not interpret its disclosed product share as AMD total spending.
MI355X / MI450
已有来源记录，以资料所述状态为准
Anthropic的产品或服务集成了超威半导体的技术。
产品／业务: MI355X
MI355X use described in partnership release
Only supports the stated product and source date; no exclusivity, procurement value or completed future capacity inferred.
资料发布日期: 2026-07-22
已宣布／计划中，尚不代表已交付
Anthropic计划在产品或服务中集成超威半导体的技术。
产品／业务: MI450
MI450 capacity roadmap; first 1GW expected 1H2027
Only supports the stated product and source date; no exclusivity, procurement value or completed future capacity inferred.
资料发布日期: 2026-07-22
相关产品或业务详见来源说明
已宣布／计划中，尚不代表已交付
OpenAI计划采用超威半导体的技术。
产品／业务: 相关产品或业务详见来源说明
6GW agreement, first 1GW expected 2H2026
Only supports the stated product and source date; no exclusivity, procurement value or completed future capacity inferred.
资料发布日期: 2025-10-06
相关产品或业务详见来源说明
已有来源记录，以资料所述状态为准
超威半导体与Arista Networks存在有来源记录的生态适配或合作。
产品／业务: 相关产品或业务详见来源说明
Arista reports working with AMD on next-generation compute silicon and NICs for scale-out AI fabrics.
Evidence identifies the stated technology or collaboration only; no exclusivity or purchase volume inferred.
x86
已有来源记录，以资料所述状态为准
超威半导体与英特尔存在有来源记录的生态适配或合作。
产品／业务: x86
Jointly founded x86 advisory group; no procurement implied
Only supports the stated product and source date; no exclusivity, procurement value or completed future capacity inferred.
资料发布日期: 2024-10-15
上市资料同步于 2026-04-16.
报告期末 2026-06-27 · 披露日期 2026-08-05
来源核查于 2026-09-13
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年度报告，截至 2025-12-27。这些是已披露的年度数据，不是过去十二个月的估算值。
AMD drives innovation in high performance and AI computing to solve the world’s most important challenges. AMD technology powers billions of experiences across cloud and AI infrastructure, embedded systems, AI PCs and gaming. With a broad portfolio of AI-optimized CPUs, GPUs, networking and software, AMD delivers full-stack solutions that help customers turn data into breakthroughs, with the speed and scale needed for a new era of intelligent computing. Our high-performance product portfolios provide differentiated solutions, including semi-custom System-on-Chip (SoCs), adaptive SoCs and accelerated processing units (APUs).
摘自第 1 项“业务”；披露于 2026-02-04。内容可能经过截取。
来源：SEC Company Facts。核查于 2026-10-04。数据在后台更新。缺失或含义不明确的数据不予展示。
