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TSMC (TSM)TSM · Estimated market cap: $2.31T USD · As of 2026-10-13
Foundry manufacturing and advanced integration for AI chips.
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Events use source publication dates; missing prices are not filled.
Participates in the semiconductors part of the AI supply chain.
Sources may describe historical activity or future plans. Source publication dates do not confirm current deliveries. ✓ Verified means one of the two companies confirmed the relationship in its own filing, investor-relations release or official announcement, and the source link was checked on the review date.
Documented — status as described by source
KLA supplies TSMC.
TSMC named KLA among its 2025 outstanding suppliers for production support
Dated company disclosure; no exclusive supply, contract value or current shipment volume inferred.
Source published: Unknown
Semiconductor materials
Documented — status as described by source
Konfoong Materials supplies TSMC.
Product / business: Semiconductor materials
KFMI's 2025 report identifies the company as a certified semiconductor target-material supplier to this customer
Certified-supplier status, not a quantified purchase commitment.
Documented — status as described by source
AMEC supplies TSMC.
中微公司2019年招股书将台积电 / TSMC列为刻蚀设备代表客户。 Named etch-equipment customer in AMEC's 2019 prospectus.
招股书历史客户披露，不证明2026年采购、现有合同或特定先进制程供货；不推定独家关系。 Historical evidence only; present orders, process nodes and volumes unverified.
Source published: 2019-07-02
Semiconductor manufacturing
Documented — status as described by source
National Silicon Industry Group supplies TSMC.
Product / business: Semiconductor manufacturing
沪硅产业2024年报将台积电 / TSMC列为半导体硅片客户。 Named silicon-wafer customer in the 2024 annual report.
已披露的2024年度客户关系；未披露对应硅片规格、订单金额或2026年出货量；不外推AI专用芯片用途。 Historical customer disclosure, not an AI-specific order.
Source published: 2025-04-24
Semiconductor manufacturing
Documented — status as described by source
TSMC supplies AMD.
Product / business: Semiconductor manufacturing
Wafer manufacturing
Only supports the stated product and source date; no exclusivity, procurement value or completed future capacity inferred.
Source published: 2026-02-04
Verified · reviewed 2026-10-01
CoWoS / Chip packaging and testing
Verified · reviewed 2026-10-01 · Documented — status as described by source
Editorial sources snapshot · 2026-10-01
TSMC supplies NVIDIA.
Product / business: CoWoS / Chip packaging and testing
NVIDIA's FY2026 Form 10-K names TSMC as a semiconductor wafer foundry. Separately, the filing discloses NVIDIA's use of CoWoS technology for semiconductor packaging.
The filing does not allocate CoWoS work among suppliers or disclose wafer volumes, packaging capacity shares, exclusivity or contract terms.
Source published: 2026-02-25
Chip packaging and testing
Announced / planned — delivery not confirmed
Amkor Technology and TSMC announced a collaboration plan.
Product / business: Chip packaging and testing
Amkor and TSMC signed an MOU for advanced packaging and test collaboration in Arizona
Planned Arizona capacity and services; do not infer that the facility is operational.
Source published: 2024-10-04
Documented — status as described by source
Marvell and TSMC collaborate on the business described in the sources.
Existing 5nm/3nm platform collaboration
Only supports the stated product and source date; no exclusivity, procurement value or completed future capacity inferred.
Source published: 2024-03-07
Announced / planned — delivery not confirmed
Marvell and TSMC announced a collaboration plan.
2nm infrastructure silicon platform development
Only supports the stated product and source date; no exclusivity, procurement value or completed future capacity inferred.
Source published: 2024-03-07
Design tools / technical qualification
Documented — status as described by source
Synopsys and TSMC have a documented ecosystem integration or collaboration.
Product / business: Design tools / technical qualification
Synopsys announced silicon-proven IP and certified EDA design flows for TSMC technologies
Dated technical relationship; no exclusive supplier status or purchase volume inferred.
Source published: 2026-04-22
Loading SEC business and financials…
Listing data synced 2026-09-10. This is the listing record date, separate from quote updates.
Period ended 2026-06-30 · Published 2026-08-14
Sources checked 2026-09-13 · Profile review date, separate from quote updates.
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Estimated market cap
2.31T USD
As of 2026-10-13
Latest cached closing price × reported ordinary shares outstanding ÷ ordinary shares per US-listed unit.
Ordinary shares per US-listed unit: 5 · Listing ratio source ↗
Share count as of 2026-06-30
Filed 2026-08-14 ↗Annual report for the year ended 2025-12-31. These are reported annual figures, not trailing twelve-month estimates.
A business excerpt is not available. Read the annual report for the company’s description.
Read the 20-F annual report ↗Source: SEC Company Facts. Checked 2026-10-13. Data is refreshed in the background. Missing or ambiguous figures are left unavailable.