GPUs, CPUs, NVLink and Spectrum-X networking, rack-scale systems and CUDA
NVIDIA’s AI ecosystem: what has shipped and what is still a plan?
Sources reviewed: · A selected research view, not a complete relationship inventory. Source dates are separate from review dates.
NVIDIA spans five layers of AI infrastructure: chips, networking, systems, software and cloud. It owns no fabs. TSMC makes its wafers, SK hynix, Micron and Samsung supply its memory, and builders such as Dell and Foxconn assemble its racks. Treating every connection as an “order” mixes up the strength of the evidence: an annual-report disclosure, a first delivery, racks running at a partner and a letter of intent are different things.
Key companies
Wafer foundry for NVIDIA, including Blackwell wafers in Arizona
Memory supplier; multiyear memory partnership announced for Vera Rubin
Memory supplier; HBM4 in volume production for Vera Rubin
Memory supplier and wafer foundry; HBM4 designed for Vera Rubin
Delivered the first GB300 NVL72 and Vera Rubin NVL72 racks to CoreWeave
Neocloud that brought up the first Vera Rubin NVL72 racks
Azure named by NVIDIA as running Vera Rubin racks
Model lab with up to 1 GW of planned Grace Blackwell and Vera Rubin capacity
NVIDIA’s position across five layers
| Layer | NVIDIA’s position | Source |
|---|---|---|
| Chips and memory See connections → | NVIDIA is fabless. It designs GPUs and Arm-based CPUs (Grace, now Vera) and relies on foundries, memory suppliers and contract manufacturers for every manufacturing step. | |
| Networking See connections → | NVLink interconnects and switches, and end-to-end InfiniBand and Ethernet platforms: network adapters, cables, DPUs, switch chips and systems, plus software. NVIDIA reports networking inside its Compute & Networking segment, whose revenue grew 18% from the prior quarter and 114% from a year earlier in Q2 FY2027. | |
| Systems See connections → | Data center products are typically delivered as rack-scale systems, subsystems or modules. OEMs and ODMs such as Dell, HPE, Supermicro, Foxconn and Wistron build the racks customers receive. | |
| Software / CUDA See connections → | CUDA runs on all NVIDIA GPUs and sits beneath hundreds of domain-specific libraries, frameworks and SDKs. NVIDIA describes its developer base and installed base as strengthening the ecosystem. | |
| Cloud and customers See connections → | Data center revenue was $89.0 billion in Q2 FY2027 (quarter ended July 26, 2026), up 117% from a year earlier. Most GPUs reach end users through hyperscalers, neoclouds and model labs, often indirectly via OEMs and ODMs. |
Product roadmap: shipped vs announced
Shipped / in use
Shipping in volume
Blackwell reached volume production; NVIDIA marked the first Blackwell wafer produced at TSMC Arizona.
Shipped / in use
Shipping; NVIDIA cites its ramp for Q2 FY2027 growth
Announced at GTC in March 2025 for the second half of 2025. The first GB300 NVL72 reached CoreWeave in July 2025, and NVIDIA attributes Q2 FY2027 data center growth to the Blackwell Ultra ramp.
Announced / planned
Ramping; first racks delivered, broad shipments from fall 2026
Six chips (Vera CPU, Rubin GPU, NVLink 6 Switch, ConnectX-9, BlueField-4, Spectrum-6) announced in January 2026. NVIDIA said production shipments begin in fall 2026. Early racks are already running at CoreWeave and several clouds.
Suppliers, customers and partners
| Connection / status | Sources and limits | Source and next step |
|---|---|---|
| TSMC → NVIDIA · Wafers; disclosed CoWoS use Shipped / in use Disclosed in annual report Chips and memory · Supplier | NVIDIA's 10-K names TSMC and Samsung as the foundries that produce its semiconductor wafers and says it uses CoWoS technology for semiconductor packaging. What does this not establish?The filing establishes a manufacturing dependency. It does not disclose wafer volumes, how CoWoS capacity is split between suppliers, or contract terms. | Open company → Open in map → |
| TSMC Arizona · First US-made Blackwell wafer Shipped / in use Wafers in volume production Chips and memory · Supplier | NVIDIA said TSMC's Phoenix fab was producing Blackwell wafers in volume when it marked the first Blackwell wafer made in the US. What does this not establish?The post concerns wafer fabrication only. It does not say where those wafers are packaged or what share of Blackwell supply comes from Arizona. | Open company → Open in map → |
| SK hynix, Micron, Samsung → NVIDIA · Memory Shipped / in use Disclosed in annual report Chips and memory · Supplier | NVIDIA's 10-K says it purchases memory from SK hynix, Micron and Samsung. What does this not establish?The filing names suppliers but does not rank them, split purchases by HBM generation, or tie a supplier to a specific GPU. | Open company → Open in map → |
| SK hynix · Multiyear memory partnership Announced / planned Partnership announced Chips and memory · Supplier | NVIDIA and SK hynix announced a multiyear partnership to co-develop memory for Vera Rubin, Vera CPUs, RTX Spark PCs and Jetson Thor. It supports supply of advanced memory. What does this not establish?The announcement does not disclose volumes, prices or a contract value. Figures in press coverage are not confirmed by this source. | Open company → Open in map → |
| Micron → NVIDIA · HBM4 for Vera Rubin Shipped / in use High-volume production Chips and memory · Supplier | Micron announced high-volume production of 36GB 12-high HBM4 designed for NVIDIA Vera Rubin. What does this not establish?Production for a platform is not a disclosed share of NVIDIA's HBM purchases, and it does not establish exclusivity. | Open company → Open in map → |
| Micron · HBM3E 12H designed into Blackwell Ultra Announced / planned Design-in announced Chips and memory · Supplier | Micron said its HBM3E 12H 36GB is designed into NVIDIA HGX B300 NVL16 and GB300 NVL72, and that its SOCAMM was developed with NVIDIA for GB300. What does this not establish?A design-in announcement predates shipments and does not show volumes. Treat it as a design win, not as delivery evidence. | Open company → Open in map → |
| Samsung · HBM4 for Vera Rubin Shipped / in use Mass production Chips and memory · Supplier | Samsung said at NVIDIA GTC 2026 that its HBM4, designed for the Vera Rubin platform, is in mass production. What does this not establish?Mass production for a platform does not disclose NVIDIA's purchase volumes or qualification status for each product. | Open company → Open in map → |
What should you verify next?
The next Vera Rubin checkpoint is production shipments from fall 2026: watch for cloud instance launches, system-builder delivery announcements and Rubin’s revenue contribution in NVIDIA’s quarterly results. Letters of intent and “up to” commitments need a later purchase agreement or deployment announcement. This page preserves the scope of the cited evidence; it does not assume every announced plan has been fulfilled.