Helios
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已宣布/计划中,尚不代表已交付
超威半导体与超微电脑已宣布合作计划。
产品/业务: Helios
来源说明与适用范围
Supermicro announced an AMD Helios rack-scale platform within its DCBBS architecture.
Platform showcase and development announcement; does not prove volume deployment.
公司研究
正在加载 SEC 业务与财务数据…
参与 AI 产业链的系统与终端环节。
资料可能描述历史情况或未来计划,资料发布日期不代表当前已交付。 ✓ 已核实:两家公司之一在其监管文件、投资者关系公告或官方声明中确认了该关系,且来源链接已在复核日期检查。
Helios
已宣布/计划中,尚不代表已交付
超威半导体与超微电脑已宣布合作计划。
产品/业务: Helios
Supermicro announced an AMD Helios rack-scale platform within its DCBBS architecture.
Platform showcase and development announcement; does not prove volume deployment.
相关产品或业务详见来源说明
已宣布/计划中,尚不代表已交付
思科与超微电脑已宣布合作计划。
产品/业务: 相关产品或业务详见来源说明
Cisco announced Supermicro compute integration into Secure AI Factory with NVIDIA, with offerings planned from October 2026.
Future channel availability; not already completed October delivery.
内存与存储
已有来源记录,以资料所述状态为准
美光科技与超微电脑存在有来源记录的生态适配或合作。
产品/业务: 内存与存储
Micron identifies joint STAC-M3 benchmarking with Supermicro and Intel using Micron SSDs and DDR5
Benchmark collaboration only; no direct supply contract, shipment volume or AI production deployment is established. Undated page.
MI350
已宣布/计划中,尚不代表已交付
超微电脑计划在产品或服务中集成超威半导体的技术。
产品/业务: MI350
MI350 system portfolio announcement; individual delivery unverified
Only supports the stated product and source date; no exclusivity, procurement value or completed future capacity inferred.
资料发布日期: 2025-06-12
上市资料同步于 2026-04-16.
报告期末 2026-06-30 · 披露日期 2026-08-31
来源核查于 2026-09-13
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年度报告,截至 2026-06-30。这些是已披露的年度数据,不是过去十二个月的估算值。
We are a Silicon Valley-based provider of total information technology ("IT") solutions which address demanding workloads from the enterprise and cloud to the intelligent edge. We deliver rack-scale solutions optimized for various workloads, including artificial intelligence (“AI”) and high-performance computing (“HPC”), where acceleration is critical. Additionally, we offer an extensive portfolio of server and storage solutions for enterprise data centers, cloud service providers ("CSPs"), and edge computing applications, such as 5G Telco, Retail and embedded.
摘自第 1 项“业务”;披露于 2026-08-31。内容可能经过截取。
来源:SEC Company Facts。核查于 2026-10-04。数据在后台更新。缺失或含义不明确的数据不予展示。